School of Electrical Engineering and Computer Science

Electronics Engineering Laboratory standard procedures

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The primary purpose of a standard procedure is as follows:

  • To provide detailed instructions and guidance relating to the process or activity being undertaken, thus ensuring manufacturing and/or assembly processes are carried out in a well defined and repeatable manner thereby greatly reducing or eliminating defects brought about by the introduction of ad hoc processes.
  • To provide important workplace health & safety information relevant to the process or activity being undertaken.
  • To be integrated into and used in the quality control of design and manufacturing activities.
  • To provide a medium by which accumulated knowledge and expertise is archived and permanently retained for future reference.

In order to comply with quality control protocols, strict adherence to EEL Standard Procedures is required at all times and without exception.

Should there be a need to deviate from prescribed procedures for any reason, the Engineering & Technical Support Manager must be informed at the earliest opportunity and the process or procedure reviewed without delay.

Register of EEL Standard Procedures

Current

  • Contac II (K062) Chemical Preparation
  • Contac II (K062) Plating Procedure
  • Crimp Connector BNC RG 174 Assembly Instructions
  • Crimp Connector BNC RG 58 Assembly Instructions
  • Crimp Connector N Type RG 58 Assembly Instructions
  • Chipbonder 3609 Application Instructions
  • PCB Production - Pre-coated Positive Photo Resist
  • Test and Tag
  • Bungard Laminator (K146) Etch Resist Lamination
  • Spray Etcher (K145) Operating Procedure
  • Developing Tank (K070) Operating Procedure
  • PCB Artwork Gerber Files - NC Drill / Cutout
  • PCB Artwork Gerber Files - Manual Drill / Cutout

Pending

  • PCB Tinning Procedure
  • Bungard Laminator (K146) Solder Mask Lamination
  • Photoplotter (K144) Artwork Production
  • Protomat C100/HF (K045) PCB Drilling & Routing

Obsolete